mucar bt200 compaund clearing, очистка компаунда

telegramm group diagzone, xdiag, xpro5, prodiag software sales +79536710194 mucar bt200, ediag mini очистка мастики, очистка компаунда подготовка к прошивке mastic clearing, compound cleaning preparation for firmware We prepare the board for firmware. We will need to clear the mastic and compound from the points for connecting the programmer. We use a soldering fan, thermal tape and a wooden toothpick. We apply thermal tape to protect the elements on the board. We set the temperature on the soldering fan to 320 degrees and the weakest air flow. We heat the area of the board where the points for connecting the programmer are located for 2 minutes. We are trying to insert the toothpick under the compound. We feel that the compound has become softer. If necessary, heat for another 1 minute. After this, you should be able to forcefully insert the toothpick under the compound. A piece will come off and 1 or 2 points will open. If necessary, heat for another 30 seconds and clean the third point. Be careful, there is a resistor near the points, do not tear it off. Подготавливаем плату для прошивки. Нам потребуется очистить от мастики, компаунда точки для подключения программатора. Используем паяльный фен, термоскотч и деревянную зубочистку. Наклеиваем термоскотч для защиты элементов на плате. Устанавливаем на паяльном фене температуру 320 градусов и самый слабый поток воздуха. Греем участок платы где находятся точки для подключения программатора в течение 2х минут. Пытаемся...