Automated TH SMA Connector Placement with Solder preforms

This video demonstrates EPE Corporation&ability to place through-hole SMA type connectors with automated surface-mount placement equipment. In addition to screen printing solder paste around each through-hole in the raw PWB, we also placed solder pre-forms around each hole in order to provide enough solder volume to fill the holes when the parts are sent through the re-flow oven to meet IPC 610 class 3 requirements (75% barrel fill). Solder pre-forms were required in this particular application due to the limited space on the surface of the raw PWB around each of the through-hole insertion locations. With applications where there is enough room, our engineers can design screen-print stencils that have openings large enough around each through-hole lead to deposit the adequate amount of solder paste to achieve the required result.